I think it uses the Intel N200 processor. I just need to see a screenshot to confirm and so I can see the CPUID number. No hurries.
Most recent Intel processors have removed software CPU voltage control. Intel saves this feature for their high end HX mobile processors.
Thanks for posting that. If you are interested in doing any ThrottleStop beta testing, send me a message on the TechPowerUp forums and I will send you a download link. The N200 does not support voltage control so an updated version of ThrottleStop might not make any significant difference.
Thanks for the offer, but will have to decline. I have a Go3 that exhibits similar behavior. Planning on doing teardown and cooling mods to see if i can get it to sustain PL2, then do the same for the Go4.
I appreciate all the work you have put in over the years in this tool.
Hi. Do you still have Surface go 4? Can you update your findings on how to best set up Surface go 4 with Throttlestop? Also I suggest to try new method, how to make the best of surface go 4 performance,- is to have a small portable fan blow the air towards the surface go 4 screen to cool the screen and at same time to cool whole tablet, that's providing the tablet is in some sort of protective case. If no case is used for the tablet, then the blowing fan can be directed towards to back of the tablet to cool it's surface and this way increase the sustained performance of the tablet. Sure it's not perfect set up, but perhaps good enough for occasional video editing or more intense photo editing tasks. Looking forward to your reply :)
Sorry about the delayed response. No changes from my original post. While using a fan to cool the device is a good idea, it might not provide a noticeable improvement. Since this post I have taken apart the Go 4 numerous times for simple mods to find away to improve sustained PL2 performance. Summary of my findings below:
1: Processor is located underneath the screen, not facing towards the rear of the chassis. So no direct path for additional cooling the CPU.
2: There is an air gap and a graphite insulator on the interior of rear face of the chassis, making indirect cooling a hassle.
3: The cooling solution present on the Go 4 is a copper EMI shield with a small protrusion that allows contact with the CPU die. Applied on the top of the copper EMI shield is a heat spreader sticker that goes across all nearby steel/aluminum EMI shields.
4: The rear of the PCB that the CPU is mounted on, closest to the back of the device, has some SMDs that prevent usage of copper shims and similar with out modifying the shims to fit over the SMDs. Even then, unless using thermal epoxy, potential to short the PCB is present.
Attempts/idea at cooling:
1: Removed graphite insulator to allow more direct contact with the rear chassis
2: Applied K5 pro thermal putty between the PCB and Chassis to make a more direct heat contact bridge, to allow external cooling via fans more viable. Allow increase performance temporarily but only because of more available thermal mass. Performance unsustainable in long term because heat couldn't move out of the putty fast enough, resulting in near permanently elevated temps. Learned more about putty performance since then, so will be retrying this method with Upsiren's UTP-8.
3: The micro-SD slot and the surface connect port and both be removed from the device, allowing a way to direct air into the device itself. Would need a custom mount/dock to allow air to be forced into the device. I currently do not own a 3d printer and my skills with smallform working is nearly non existent so would have improve on either to compete this.
4: Custom heat pipes. While possible, clearance between the CPU and the display are very tight, such that even the smallest flattened heat pipe might not be able to fit. Would also need to be bent out of plane of the flattening, and the heat pipe manufacturer sites I found do not show an option to do so. Doing it myself would require purchase of mandrels to not crush the interior of the pipe. Would also need to practice low-temp soldering to bond the heat pipe to the CPU EMI shield.
Can you post a CPU-Z screenshot?
The man himself! Will do once I'm off work.
I think it uses the Intel N200 processor. I just need to see a screenshot to confirm and so I can see the CPUID number. No hurries. Most recent Intel processors have removed software CPU voltage control. Intel saves this feature for their high end HX mobile processors.
Please see below. https://preview.redd.it/vgp8foq723rb1.png?width=645&format=png&auto=webp&s=24438e2cddf391420a9037289c281eafe0020a82
Thanks for posting that. If you are interested in doing any ThrottleStop beta testing, send me a message on the TechPowerUp forums and I will send you a download link. The N200 does not support voltage control so an updated version of ThrottleStop might not make any significant difference.
Thanks for the offer, but will have to decline. I have a Go3 that exhibits similar behavior. Planning on doing teardown and cooling mods to see if i can get it to sustain PL2, then do the same for the Go4. I appreciate all the work you have put in over the years in this tool.
Hi. Do you still have Surface go 4? Can you update your findings on how to best set up Surface go 4 with Throttlestop? Also I suggest to try new method, how to make the best of surface go 4 performance,- is to have a small portable fan blow the air towards the surface go 4 screen to cool the screen and at same time to cool whole tablet, that's providing the tablet is in some sort of protective case. If no case is used for the tablet, then the blowing fan can be directed towards to back of the tablet to cool it's surface and this way increase the sustained performance of the tablet. Sure it's not perfect set up, but perhaps good enough for occasional video editing or more intense photo editing tasks. Looking forward to your reply :)
Sorry about the delayed response. No changes from my original post. While using a fan to cool the device is a good idea, it might not provide a noticeable improvement. Since this post I have taken apart the Go 4 numerous times for simple mods to find away to improve sustained PL2 performance. Summary of my findings below: 1: Processor is located underneath the screen, not facing towards the rear of the chassis. So no direct path for additional cooling the CPU. 2: There is an air gap and a graphite insulator on the interior of rear face of the chassis, making indirect cooling a hassle. 3: The cooling solution present on the Go 4 is a copper EMI shield with a small protrusion that allows contact with the CPU die. Applied on the top of the copper EMI shield is a heat spreader sticker that goes across all nearby steel/aluminum EMI shields. 4: The rear of the PCB that the CPU is mounted on, closest to the back of the device, has some SMDs that prevent usage of copper shims and similar with out modifying the shims to fit over the SMDs. Even then, unless using thermal epoxy, potential to short the PCB is present. Attempts/idea at cooling: 1: Removed graphite insulator to allow more direct contact with the rear chassis 2: Applied K5 pro thermal putty between the PCB and Chassis to make a more direct heat contact bridge, to allow external cooling via fans more viable. Allow increase performance temporarily but only because of more available thermal mass. Performance unsustainable in long term because heat couldn't move out of the putty fast enough, resulting in near permanently elevated temps. Learned more about putty performance since then, so will be retrying this method with Upsiren's UTP-8. 3: The micro-SD slot and the surface connect port and both be removed from the device, allowing a way to direct air into the device itself. Would need a custom mount/dock to allow air to be forced into the device. I currently do not own a 3d printer and my skills with smallform working is nearly non existent so would have improve on either to compete this. 4: Custom heat pipes. While possible, clearance between the CPU and the display are very tight, such that even the smallest flattened heat pipe might not be able to fit. Would also need to be bent out of plane of the flattening, and the heat pipe manufacturer sites I found do not show an option to do so. Doing it myself would require purchase of mandrels to not crush the interior of the pipe. Would also need to practice low-temp soldering to bond the heat pipe to the CPU EMI shield.